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LM111, LM211, LM311, LM311Y DIFFERENTIAL COMPARATORS WITH STROBES SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992 D D D D D D Fast Response Times Strobe Capability Maximum Input Bias Current . . . 300 nA Maximum Input Offset Current . . . 70 nA Can Operate From Single 5-V Supply Designed to Be Interchangeable With National Semiconductor LM111, LM211, and LM311 LM111 . . . J PACKAGE (TOP VIEW) NC EMIT OUT IN + IN – NC VCC – BALANCE 1 2 3 4 5 6 7 14 13 12 11 10 9 8 NC NC NC VCC + NC COL OUT BAL/STRB description The LM111, LM211, and LM311 are single high-speed voltage comparators. These devices are designed to operate from a wide range of power supply voltages, including ± 15-V supplies for operational amplifiers and 5-V supplies for logic systems. The output levels are compatible with most TTL and MOS circuits. These comparators are capable of driving lamps or relays and switching voltages up to 50 V at 50 mA. All inputs and outputs can be isolated from system ground. The outputs can drive loads referenced to ground, VCC + or VCC –. Offset balancing and strobe capabilities are available, and the outputs can be wire-OR connected. If the strobe is low, the output will be in the off state regardless of the differential input. The LM111 is characterized for operation over the full military range of – 55°C to 125°C. The LM211 is characterized for operation from – 40°C to 85°C, and the LM311 is characterized for operation from 0°C to 70°C. LM111 . . . JG PACKAGE LM211, LM311 . . . D, DB, P, OR PW PACKAGE (TOP VIEW) EMIT OUT IN + IN – VCC – 1 2 3 4 8 7 6 5 VCC + COL OUT BAL/STRB BALANCE LM111 . . . U PACKAGE (TOP VIEW) EMIT OUT IN + IN – NC VCC – •1 2 3 4 5 10 9 8 7 6 VCC + COL OUT NC BAL/STRB BALANCE LM111 . . . FK PACKAGE (TOP VIEW) functional block diagram BALANCE BAL/STRB + COL OUT EMIT OUT IN+ IN– – NC IN + NC IN – NC 4 5 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13 NC EMIT OUT NC VCC + NC NC COL OUT NC BAL/STRB NC Copyright © 1992, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 NC VCC – NC BALANCE NC 1 LM111, LM211, LM311, LM311Y DIFFERENTIAL COMPARATORS WITH STROBES SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax at 25°C SMALL OUTLINE (D)† LM311D SSOP (DB) CHIP CERAMIC CARRIER DIP (FK) (J) CERAMIC DIP (JG) PLASTIC DIP (P) LM311P TSSOP (PW) FLATPACK (U) CHIP FORM (Y) 0°C to 70°C – 40°C to 85°C 7.5 mV LM311DBLE LM311PWLE LM311Y 3 mV LM211D LM211P – 55°C to 3 mV LM111FK LM111J LM111JG LM111U 125°C † The D package is available taped and reeled. Add the suffix R (e.g., LM311DR). The DB and PW packages are only available left-end taped and reeled. schematic BAL/STRB BALANCE 300 Ω VCC + 1.3 kΩ 1.3 kΩ 750 Ω 70 Ω 1.2 kΩ 600 Ω 300 Ω IN + 1.2 kΩ 4 kΩ COL OUT IN – 400 Ω 60 Ω 450 Ω 250 Ω 200 Ω 2 kΩ 4Ω EMIT OUT VCC – Component Count Resistors Diodes Epifet Transistors 20 2 1 22 600 Ω 130 Ω All resistor values shown are nominal. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LM111, LM211, LM311, LM311Y DIFFERENTIAL COMPARATORS WITH STROBES SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992 LM311Y chip information This chip, when properly assembled, displays characteristics similar to the LM311. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS (1) (8) (5) BALANCE (7) IN+ (2) + (3) (6) (4) – VCC+ (8) COL OUT (7) (2) IN– BAL/STRB 62 (1) VCC – EMIT OUT (3) CHIP THICKNESS: 15 TYPICAL (4) (5) 50 (6) BONDING PADS: 4 × 4 MINIMUM TJ max = 15... |
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