Maker : National Semiconductor
Part No. : LM3301

  Datasheet PDF : LM3301.pdf
  Cross Reference : LM3301 Cross Reference
  Buy Component : LM3301 Find Stock and Price

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Product Information

LM2900 LM3900 LM3301 Quad Amplifiers February 1995 LM2900 LM3900 LM3301 Quad Amplifiers General Description The LM2900 series consists of four independent dual input internally compensated amplifiers which were designed specifically to operate off of a single power supply voltage and to provide a large output voltage swing These amplifiers make use of a current mirror to achieve the non-inverting input function Application areas include ac amplifiers RC active filters low frequency triangle squarewave and pulse waveform generation circuits tachometers and low speed high voltage digital logic gates Features Y Y Y Y Y Y Y Y Wide single supply voltage 4 VDC to 32 VDC g 2 VDC to g 16 VDC Range or dual supplies Supply current drain independent of supply voltage Low input biasing current 30 nA High open-loop gain 70 dB Wide bandwidth 2 5 MHz (unity gain) a Large output voltage swing (V b 1) Vp-p Internally frequency compensated for unity gain Output short-circuit protection Schematic and Connection Diagrams Dual-In-Line and S O TL H 7936 – 2 Top View Order Number LM2900N LM3900M LM3900N or LM3301N See NS Package Number M14A or N14A TL H 7936 – 1 C1995 National Semiconductor Corporation TL H 7936 RRD-B30M115 Printed in U S A Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications LM2900 LM3900 LM3301 Supply Voltage 32 VDC 28 VDC g 16 VDC g 14 VDC Power Dissipation (TA e 25 C) (Note 1) Molded DIP 1080 mW 1080 mW S O Package 765 mW a b Input Currents IIN or IIN 20 mADC 20 mADC Output Short-Circuit Duration One Amplifier Continuous Continuous TA e 25 C (See Application Hints) b 40 C to a 85 C Operating Temperature Range b 40 C to a 85 C LM2900 LM3900 0 C to a 70 C b 65 C to a 150 C b 65 C to a 150 C Storage Temperature Range 260 C Lead Temperature (Soldering 10 sec ) 260 C Soldering Information Dual-In-Line Package Soldering (10 sec ) 260 C 260 C Small Outline Package Vapor Phase (60 sec ) 215 C 215 C Infrared (15 sec ) 220 C 220 C See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering surface mount devices ESD tolerance (Note 7) 2000V 2000V Electrical Characteristics TA e 25 C Parameter Open Loop Voltage Gain Voltage Gain Input Resistance Output Resistance Unity Gain Bandwidth Input Bias Current Slew Rate Supply Current Output Voltage Swing VOUT High VOUT Low VOUT High V e Absolute Maximum Ratings a V a e 15 VDC unless otherwise stated LM2900 Conditions Min Over Temp DVO e 10 VDC Inverting Input Typ Max Min LM3900 Typ Max Min LM3301 Units Typ Max V mV MX kX MHz 300 nA V ms 10 mADC 12 28 1 8 12 28 1 8 25 12 28 1 9 25 Inverting Input Inverting Input V Inverting Input a 25 e 5 VDC 30 05 20 62 13 5 0 09 200 30 05 20 200 30 05 20 Positive Output Swing Negative Output Swing RL e % On All Amplifiers RL e 2k a V e 15 0 VDC b IIN e 0 IIN a e 0 b IIN e 10 mA a IIN e 0 10 13 5 02 62 10 13 5 62 0 09 02 0 09 02 VDC IIN e 0 a IIN e 0 RL e % b 29 5 6 18 13 5 29 5 6 05 10 13 5 26 0 5 05 18 13 5 mADC Output Source Current Sink Capability ISINK (Note 2) b VOL e 1V IIN e 5 mA 05 2 Electrical Characteristics (Note 6) Parameter Power Supply Rejection Mirror Gain DMirror Gain Mirror Current Negative Input Current Input Bias Current Conditions V a e 15 VDC unless otherwise stated (Continued) LM2900 Min TA e 25 C f e 100 Hz 20 mA (Note 3) 200 mA (Note 3) 20 mA to 200 mA (Note 3) (Note 4) TA e 25 C (Note 5) Inverting Input 0 90 0 90 Typ 70 10 10 2 10 10 300 11 11 5 500 0 90 0 90 Max Min LM3900 Typ 70 10 10 2 10 10 300 11 11 5 500 0 90 0 90 Max Min LM3301 Units Typ 70 1 1 2 10 10 1 10 1 10 5 500 Max dB mA mA % mADC mADC nA Note 1 For operating at high temperatures the device must be derated based on a 125 C maximum junction temperature and a thermal resistance of 92 C W which applies for the device soldered in a ...

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