Maker : Protek Devices
Part No. : P0408FCxxC

  Datasheet PDF : P0408FCxxC.pdf
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Product Information

05156 P0408FC3.3C* thru P0408FC36C* PFLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns 0402 CHIP SHOWN FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Voltages Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 4 to 7 Lines ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0408 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION 05156.R6 2/07 1 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0408FC3.3C* thru P0408FC36C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TA TSTG VALUE 250 -55 to 150 -55 to 150 UNITS Watts °C °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 11.0 13.2 19.8 25.4 37.2 70.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID µA 75* 10** 10*** 1 1 1 1 TYPICAL CAPACITANCE VWM VOLTS P0408FC3.3C P0408FC05C P0408FC08C P0408FC12C P0408FC15C P0408FC24C P0408FC36C 3.3 5.0 8.0 12.0 15.0 24.0 36.0 @ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 40.0 @8/20µs VC @ IPP 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A @0V, 1 MHz C pF 150 100 75 50 40 30 25 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 10,000 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 120 100 80 60 40 20 0 tf FIGURE 2 PULSE WAVE FORM Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 1,000 250W, 8/20µs Waveform e-t 100 td = t I /2 PP 10 0.01 1 10 100 td - Pulse Duration - µs 1,000 10,000 0 5 10 15 t - Time - µs 20 25 30 05156.R6 2/07 2 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0408FC3.3C* thru P0408FC36C* GRAPHS 100 80 % Of Rated Power FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20µs 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR P0408FC05C 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0408FC05C 14 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 15 20 05156.R6 2/07 VC - Clamping Voltage - Volts 3 www.protekdevices.com *U.S. Patent No. Des. “D456,367S” P0408FC3.3C* thru P0408FC36C* APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead:...

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