Maker : Texas Instruments
Part No. : SN74AUC2G06

Datasheet PDF : SN74AUC2G06.pdf
Cross Reference : SN74AUC2G06 Cross Reference
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Product Information

SN74AUC2G06 DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES442C – MAY 2003 – REVISED JANUARY 2007 FEATURES • • Available in the Texas Instruments NanoFree™ Package Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub-1-V Operable Max tpd of 2.5 ns at 1.8 V DBV PACKAGE (TOP VIEW) • • • • • • • Low Power Consumption, 10 µA at 1.8 V ±8-mA Output Drive at 1.8 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 1A GND 2A 1 6 1Y VCC 2Y 1A GND 1 2 3 6 5 4 1Y VCC 2Y 2A GND 1A 3 4 2 5 1 6 2Y VCC 1Y 2 5 2A 3 4 See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This dual inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The output of the SN74AUC2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE (1) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) –40°C to 85°C SOT (SOT-23) – DBV SOT (SC-70) – DCK (1) (2) Reel of 3000 Reel of 3000 Reel of 3000 ORDERABLE PART NUMBER SN74AUC2G06YZPR SN74AUC2G06DBVR SN74AUC2G06DCKR TOP-SIDE MARKING (2) _ _ _UT_ U06_ UT_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. www.DataSheet4U.com PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2007, Texas Instruments Incorporated SN74AUC2G06 DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES442C – MAY 2003 – REVISED JANUARY 2007 www.ti.com FUNCTION TABLE (EACH INVERTER) INPUT A H L OUTPUT Y L H LOGIC DIAGRAM (POSITIVE LOGIC) 1A 1 6 1Y 2A 3 4 2Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC VI VO VO IIK IOK IO Supply voltage range Input voltage range (2) Voltage range applied to any output in the high-impedance or power-off state (2) Output voltage range (2) VI < 0 VO < 0 Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND DBV package θJA Tstg (1) (2) (3) Package thermal impedance (3) Storage temperature range DCK package YZP package –65 –0.5 –0.5 –0.5 –0.5 MAX 3.6 3.6 3.6 VCC + 0.5 –50 –50 ±20 ±100 165 259 123 150 °C °C/W UNIT V V V V mA mA mA mA Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions ...

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