Maker : Mimix Broadband
Part No. : XE1000-BD

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Product Information

2.0-16.0 GHz GaAs MMIC Frequency Divider April 2007 - Rev 17-Apr-07 E1000-BD Features Divide-by-Four +5.0 dBm Output Power -30 dBc Fundamental Leakage Single-ended or Differential Input & Output 100% On-Wafer, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010 Chip Device Layout XE1000-BD General Description Mimix Broadband's 2.0-16.0 GHz GaAs MMIC freqency divider is an ECL (Emitter Coupled Logic) static frequency divider (divide-by-four) consisting of two cascaded divide-by-two circuits. Even-order harmonic levels are minimized by driving the inputs with a balanced input signal, and by taking the output differentially, but the circuit can be operated in a single-ended fashion with unused inputs & outputs open circuit. This MMIC uses Mimix Broadband's 2 um GaAs HBT device model technology to ensure high reliability and uniformity. The chip has surface www.DataSheet4U.com passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications. Absolute Maximum Ratings Supply Voltage (Vcc) Supply Current (Icc) Input Power (Pin) Storage Temperature (Tstg) Operating Temperature (Ta) Junction Temperature (Tch) +7.0 VDC 150 mA +15 dBm -65 to +165 OC -55 to MTTF Table1 MTTF Table1 (1) Junction temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life. Electrical Characteristics (Ambient Temperature T = 25 oC) Parameter Input Frequency Range (f ) Output Frequency Range (f ) Input Power (Pin) Output Power (Pout) Fin Suppression Fin/2 Suppression 3*Fin/4 Suppression 2*Fin Suppression Supply Voltage (Vcc) Supply Current (Icc) (Vcc=5.0V Typical) Units GHz GHz dBm dBm dBc dBc dBc dBc VDC mA Min. 2.0 0.5 -20.0 +4.0 - Typ. +5.0 -30.0 -25.0 -15.0 -35.0 +5.0 110 Max. 16.0 4.0 +5.0 +6.0 130 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 1 of 5 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-16.0 GHz GaAs MMIC Frequency Divider April 2007 - Rev 17-Apr-07 E1000-BD Divider Measurements Output Power vs. Input Frequency 10 8 Pout divide-by-four (dBm) 6 4 2 0 -2 -4 -6 0 2 4 6 8 10 12 14 16 Input Frequency (GHz) Pin -20dBm Pin -10dBm Pin -5dBm Pin 0dBm Pin +5dBm Output Harmonics & Sub-harmonics vs. Input Frequency 0 -10 -20 -30 -40 -50 -60 0 2 4 6 8 10 12 14 16 Input Frequency (GHz) Fin Fin/2 3*Fin/4 2*Fin Pharm (dBc) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 2 of 5 Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-16.0 GHz GaAs MMIC Frequency Divider April 2007 - Rev 17-Apr-07 E1000-BD Mechanical Drawing 0.850 (0.033) 0.525 (0.021) 0.325 (0.013) 0.0 2 1 5 0.0 XE1000-BD 3 4 0.525 (0.021) 0.325 (0.013) 0.795 (0.031) (Note: Engineering designator is 8SDV0500) 2.000 (0.079) Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.054 mg. Bond Pad #1 (RF Out...

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